Test Samsung Q330 Suri Subnotebook
Intel Core i3-350M | NVIDIA GeForce 310M | 13.30" | 2 kg
Der Intel Core i3-350M ist ein zwei-Kern Prozessor für Notebooks und taktet maximal mit 2.26 GHz. Die automatische Übertaktung namens Turbo Boost ist in der i3 Serie nicht aktiviert (Unterschied zum i5-430M). Wie auch der 430M, unterstützt der 350M keine AES, VT-d und Trusted Execution Funktionen. Die zwei Kerne basiert auf die Nehalem (Westmere) Mikro-Architektur und können dank Hyperthreading 4 Threads gleichzeitig abarbeiten.
Eine Besonderheit der neuen Dual-Core CPUs von Intel ist die Integration des Speichercontrollers und einer integrierten Grafikkarte (GMA HD) in das Package. Die CPU wird bereits in 32nm hergestellt, der Die für den Speichercontroller und die Grafikkarte jedoch noch in 45nm.
Erster Performance Test des Desktop Core i3 530 (2.93 GHz ohne Turbo) bescheinigt eine teilweise spürbar bessere Performance der neuen Architektur im Vergleich zu einem Core 2 Duo E8400 (3.0 GHz) [pconline.com.cn]. Dadurch sollte der Core i3-350M im Schnitt schneller als ein Core 2 Duo P8400 sein. Daher dürfte der i3-350M ein schneller Mittelklasse Dual-Core Prozessor sein, welcher für die meisten alle aktuellen Spiele und Applikationen genügend Rechenleistung bereitstellt.
Die integrierte Intel Graphics Media Accelerator HD (GMA HD) Grafikkarte soll nach ersten Berichten mit bis zu 500-667 MHz getaktet werden (dank Turbo Boost) und deutlich schneller werden als die alte GMA 4500MHD. Eine GeForce 9400M (ION) wird jedoch noch minimal schneller bleiben (mit besserem Treibersupport für Spiele).
Der Stromverbrauch ist mit einem TDP von 35 Watt zwar genauso hoch wie bei den T-Modellen der Core 2 Duo Serie, jedoch beinhaltet der TDP beim Core i3 auch die Grafikkarte und den Speichercontroller (beim Core 2 Duo waren diese noch im Chipsatz). Dadurch ist der Stromverbrauch des ganzen Systems wohl geringer.
Codename | Arrandale | ||||||||||||||||||||||||||||
Serie | Intel Core i3 | ||||||||||||||||||||||||||||
Serie: Core i3 Arrandale
| |||||||||||||||||||||||||||||
Taktung | 2260 MHz | ||||||||||||||||||||||||||||
Front Side Bus | 2500 | ||||||||||||||||||||||||||||
Level 2 Cache | 512 KB | ||||||||||||||||||||||||||||
Level 3 Cache | 3 MB | ||||||||||||||||||||||||||||
Anzahl von Kernen / Threads | 2 / 4 | ||||||||||||||||||||||||||||
Stromverbrauch (TDP = Thermal Design Power) | 35 Watt | ||||||||||||||||||||||||||||
Transistoren | 382+177 Millionen | ||||||||||||||||||||||||||||
Herstellungstechnologie | 32 nm | ||||||||||||||||||||||||||||
Die Größe | 81+114 mm2 | ||||||||||||||||||||||||||||
Max. Temperatur | 105 °C | ||||||||||||||||||||||||||||
Socket | BGA1288, PGA988 | ||||||||||||||||||||||||||||
Features | Hyper Threading, Enhanced Speedstep, integrierte GMA HD 667MHz, | ||||||||||||||||||||||||||||
64 Bit | 64 Bit wird unterstützt | ||||||||||||||||||||||||||||
Architecture | x86 | ||||||||||||||||||||||||||||
Vorgestellt am | 10.01.2010 | ||||||||||||||||||||||||||||
Produktinformationen beim Hersteller | ark.intel.com |
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