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Intel Core i3-10100F vs Apple S5 vs Telechips TCC8803 1GHz

Intel Core i3-10100F

► remove from comparison Intel i3-10100F

Der Intel Core i3-10100F ist ein Desktop-Prozessor mit vier Kernen auf Basis der Comet Lake S-Architektur. Der Prozessor taktet mit 3,6-4,3 GHz und kann insgesamt bis zu 8 Threads gleichzeitig bearbeiten. Gefertigt wird der Intel Core i3-10100F im verbesserten 14-nm-Prozess (14nm++). Im Vergleich zum älteren i3-9100F (Comet Lake-S) bietet der 10100F einen 100 MHz höheren Turbo-Takt, Multithreading und Support für schnelleren DDR4-2666 Speicher.

Performance

Die Leistung sollte nur leicht oberhalb des Core i3-9100F im Einstiegsbereich für Desktop-CPUs liegen. Dadurch reicht die Leistung für Office und anspruchsloses Gaming.

Grafikeinheit

Beim Intel Core i3-10100F handelt es sich um einen Prozessor ohne integrierte Grafikeinheit. 

Leistungsaufnahme

Intel beziffert die Thermal Design Power (TDP) auf 65 Watt. Somit Bedarf es keiner großen Kühlsysteme, was auch den Einbau in sehr kompakten Gehäusen ermöglicht.

Apple S5

► remove from comparison Apple S5

Der Apple S5 ist ein 64-Bit-Prozessor mit zwei Kernen der in der Apple Watch Series 5 (40 und 44 mm) eingesetzt wird. Er integriert 32 GB Speicher, Bluetooth 5.0, 1 GB RAM, 802.11 b/g/n 2.4 GHz WLAN und Satelliten Positionierung (GPS, GLONASS, Galileo, QZSS).

Telechips TCC8803 1GHz

► remove from comparison TCC8803 1GHz

ARM Mali 2D/3D graphics accelerator, DDR / DDR2 / LP-DDR2 / LP-DDR2 memory interface, LVDS Transmitter, HDMI 1.4, Composite TV-Out (NTSC / PAL), USB 2.0 HS OTG, USB 2.0 host, USB 1.1 HOST, EHI (External Host Interface), UART, NAND Flash Interface

Telechips' TCC88xx application processor will redefine the mobile device of tomorrow with new' innovative user experience by PC-like web browsing, 1080p full HD video record & playback, intuitive user interfaces, location based services and next generation social networking applications. TCC88xx supports development of planned features for the Tablet PC and HMP of tomorrow with tremendous performance and programmability to support new applications yet to be imagined. TCC88xx is equipped with hardwired VPU/GPU/ISP to maximize multimedia experience at its peak level.

 

show full text
ModelIntel Core i3-10100FApple S5Telechips TCC8803 1GHz
SeriesIntel Comet LakeApple
CodenameComet Lake
Serie:
Intel Core i9-10900K3.7 - 5.3 GHz10 / 20 cores20 MB L3
Intel Core i7-10700K3.8 - 5.1 GHz8 / 16 cores16 MB L3
Intel Core i7-107002.9 - 4.8 GHz8 / 16 cores16 MB L3
Intel Core i5-10600K4.1 - 4.8 GHz6 / 12 cores12 MB L3
Intel Core i5-10400F2.9 - 4.3 GHz6 / 12 cores12 MB L3
Intel Core i3-10100F « 3.6 - 4.3 GHz4 / 8 cores6 MB L3
Google Tensor G41.95 GHz8 / 8 cores
HiSilicon Kirin 9000W1.53 - 2.49 GHz12 / 12 cores
Samsung Exynos W10001.5 GHz5 / 5 cores
UNISOC Tiger T3101.8 - 2 GHz4 / 4 cores
Rockchip RK32881.8 GHz4 / 4 cores
Apple S5 « 2 / 2 cores
HiSilicon k3v2 Hi36201.2 GHz4 / 4 cores
Rockchip RK3066 1.5 GHz1.5 GHz2 / 2 cores
Amlogic AML8726-MX1.5 GHz2 / 2 cores
Rockchip RK31681.2 GHz2 / 2 cores
Rockchip RK2918 1.2 GHz1.2 GHz1 / 1 cores
ARM Cortex A8 1.2 GHz1.2 GHz1 / 1 cores
Telechips TCC8803 1GHz1 GHz1 / 1 cores
Loongson 2F 900MHz0.9 GHz1 / 1 cores
CSR86700.08 GHz2 cores
ARM Cortex-M4 cores
HiSilicon Hi6262 cores
DK3.5+ST2 cores
unknown cores
Google Tensor G41.95 GHz8 / 8 cores
HiSilicon Kirin 9000W1.53 - 2.49 GHz12 / 12 cores
Samsung Exynos W10001.5 GHz5 / 5 cores
UNISOC Tiger T3101.8 - 2 GHz4 / 4 cores
Rockchip RK32881.8 GHz4 / 4 cores
Apple S52 / 2 cores
HiSilicon k3v2 Hi36201.2 GHz4 / 4 cores
Rockchip RK3066 1.5 GHz1.5 GHz2 / 2 cores
Amlogic AML8726-MX1.5 GHz2 / 2 cores
Rockchip RK31681.2 GHz2 / 2 cores
Rockchip RK2918 1.2 GHz1.2 GHz1 / 1 cores
ARM Cortex A8 1.2 GHz1.2 GHz1 / 1 cores
Telechips TCC8803 1GHz « 1 GHz1 / 1 cores
Loongson 2F 900MHz0.9 GHz1 / 1 cores
CSR86700.08 GHz2 cores
ARM Cortex-M4 cores
HiSilicon Hi6262 cores
DK3.5+ST2 cores
unknown cores
Clock3600 - 4300 MHz1000 MHz
L1 Cache256 KB
L2 Cache1 MB
L3 Cache6 MB
Cores / Threads4 / 82 / 21 / 1
TDP65 Watt
Technology14 nm65 nm
Die Size126 mm2
max. Temp.100 °C
SocketLGA1200
FeaturesDDR4-2666 RAM, PCIe 3, 8 GT/s bus, MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, AES, AVX, AVX2, FMA3
Architecturex86ARM
$122 U.S.
Announced
Manufacturerark.intel.com

Benchmarks

Geekbench 5.5 - Geekbench 5.1 - 5.5 64 Bit Single-Core
1072 Points (42%)
Geekbench 5.5 - Geekbench 5.1 - 5.5 64 Bit Multi-Core
3650 Points (7%)
Linpack Android / IOS - Linpack Single Thread
13.4 MFLOPS (1%)
Sunspider - Sunspider 1.0 Total Score *
100%
1 S5 +
min: 2014     avg: 2022     median: 2022 (22%)     max: 2030 ms

Average Benchmarks Intel Core i3-10100F → 0% n=0

Average Benchmarks Apple S5 → 0% n=0

Average Benchmarks Telechips TCC8803 1GHz → 0% n=0

- Bereich der Benchmarkergebnisse für diese Grafikkarte
- Durchschnittliche Benchmarkergebnisse für diese Grafikkarte
* Smaller numbers mean a higher performance
1 This benchmark is not used for the average calculation

v1.28
log 01. 10:35:52

#0 ran 0s before starting gpusingle class +0s ... 0s

#1 checking url part for id 12774 +0s ... 0s

#2 checking url part for id 11530 +0s ... 0s

#3 checking url part for id 3327 +0s ... 0s

#4 redirected to Ajax server, took 1730453752s time from redirect:0 +0s ... 0s

#5 did not recreate cache, as it is less than 5 days old! Created at Fri, 01 Nov 2024 05:17:03 +0100 +0s ... 0s

#6 composed specs +0.004s ... 0.004s

#7 did output specs +0s ... 0.004s

#8 getting avg benchmarks for device 12774 +0.001s ... 0.005s

#9 got single benchmarks 12774 +0s ... 0.005s

#10 getting avg benchmarks for device 11530 +0.001s ... 0.006s

#11 got single benchmarks 11530 +0.003s ... 0.009s

#12 getting avg benchmarks for device 3327 +0.001s ... 0.01s

#13 got single benchmarks 3327 +0.003s ... 0.013s

#14 got avg benchmarks for devices +0s ... 0.013s

#15 min, max, avg, median took s +0.002s ... 0.015s

#16 return log +0s ... 0.015s

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> Notebook Test, Laptop Test und News > Benchmarks / Technik > Benchmarks / Technik > Prozessor Vergleich - Head 2 Head
Autor: Klaus Hinum,  8.09.2017 (Update:  1.07.2023)